A signing ceremony on the Loan Arrangement and the Loan Agreement from the Economic Development Cooperation Fund of the Government of the Republic of Korea to the Royal Government of Cambodia will be held on 8 November 2001, at 11:00 am, at the Ministry of Foreign Affairs and International Cooperation.
H. E. Mr. Uch Kiman, Secretary of State of Foreign Affairs and International Cooperation and H. E. Mr. Lee Wun-Hyung, Ambassador Extraordinary and Plenipotentiary of the Republic of Korea to the Kingdom of Cambodia will sign the Loan Arrangement.
H. E. Mr. Ouk Rabun, Secretary of State of Economics and Finance and H. E. Mr. Sung-Kyu Kim, Executive Director of the Export-Import Bank of Korea will sign the Loan Agreement.
The Loan Agreement of the amount of $20,000,000 (twenty million US dollars) is for the Capacity Expansion of the Royal Government of Cambodia's Administration Information System Project.
Phnom Penh, 7 November 2001